Highlight

  • At SPIE Photonics West 2026, we captured the strong global momentum around Co-Packaged Optics (CPO) and advanced photonic packaging.
  • We presented a scalable SiN-on-Glass photonic platform for high-density optical RDL, highlighting system-level relevance.
  • Visits to Stanford, NVIDIA, Google, and Ayar Labs provided firsthand insight into the translation of photonics research into industry and systems.

SPIE

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In January 2026, we attended SPIE Photonics West 2026, one of the world’s largest international conferences in optics and photonics, where we clearly felt the rapidly growing interest in Co-Packaged Optics (CPO).

Taewon’s presentation

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At SPIE Photonics West 2026, Ph.D. student Taewon Jin delivered an oral presentation titled “A Scalable Silicon Nitride Photonic Platform on Glass for High Density Optical RDL Integration in Panel-Level Packaging,” introducing a scalable SiN-on-Glass photonic platform for high-density optical redistribution layers (RDL), along with key design/characterization results and system-level implications.

We also explored a wide range of academic and industry exhibits, which provided a valuable snapshot of current trends in photonics and the evolving packaging ecosystem.

Silicon valley

Stanford Univ.

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Google

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Nvidia

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Ayar Labs

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After the conference, we visited Stanford Univ., Nvidia, Google and Ayar Labs in Silicon Valley.
It was a meaningful opportunity to see up close how photonics research connects to real industrial requirements and scales toward system integration.