AI Semiconductor Driving Laboratory

Welcome to the Photonic and Electronic Device and Packaging Research Group at Hanyang University

AI Semiconductor Driving Laboratory

Welcome to the Photonic and Electronic Device and Packaging Research Group at Hanyang University

Journal Publication - A comparative study of high-efficiency III-V/Si SIS ring modulators for O-band co-packaged optics

Posted on March 22, 2026

III-V/Si semiconductorinsulator-semiconductor (SIS) ring modulators optimized for O-band optical interconnects. [Read More]

Conference - OFC 2026, Poster Presentation

By Younghyun Kim

Posted on March 19, 2026

We presented our work with KIST at OFC 2026, which is one of top-tier conferences in optical communication. [Read More]

Magazine Publication - 차세대 Co-packaged Optics용 유리 기판 위 실리콘 나이트라이드 집적 광학

By Taewon Jin

Posted on February 12, 2026

We contributed an invited article to K-LIGHT magazine, highlighting our SiN-on-Glass (SING) technology as a scalable platform for wafer-level optical redistribution layers (RDL) in CPO. [Read More]

Conference - SPIE Photonics West 2026, Oral Presentation & Silicon Valley Visit

By Taewon Jin

Posted on January 29, 2026

We presented our work at SPIE Photonics West 2026 and visited Silicon Valley Visit (Stanford Univ. Google, Nvidia, Ayar Labs), gaining firsthand insight into the growing momentum around Co-Packaged Optics (CPO). [Read More]

Journal Publication - Demonstration of a SiN Grating Coupler with a Metal Reflector on a Glass Substrate

By Younghyun Kim

Posted on December 12, 2025

A uniform SiN grating coupler with an Al bottom reflector on a glass substrate for co-packaged optics, achieving a peak coupling efficiency of −5.1 dB with a 47 nm 1-dB bandwidth. [Read More]

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