ASDLHighlight
- Prof. Younghyun Kim gave an invited talk and joined the panel discussion at Workshop 4, Integrated Photonics: From LiDAR Chip to CPO/LPO (June 28, 2026).
- Invited talk: SiN-on-Glass (SiNG) as Advanced Packaging Substrates for Next-Generation CPO
- Panelist, Panel Discussion (CPO/LPO), with speakers from NTT, Corning, and the Chinese Academy of Sciences
- Seokhyun Yoon, Jihyeon Lee, and Seonghyeok Bae gave oral presentations.
- Taewon Jin, Daehong Kim, Kyungjin Cho, and Seokyeong Shin presented posters.
OECC-2026 Opening Ceremony (Prof. Younghyun Kim)
Workshop 4: Integrated Photonics, From LiDAR Chip to CPO/LPO
Prof. Younghyun Kim spoke in Session 2 (CPO/LPO) of Workshop 4, then joined the session’s panel discussion. In the talk he presented SiN-on-Glass (SiNG) as a photonic packaging platform for next-generation co-packaged optics (CPO) and described a set of passive and active components built on glass for dense optical interconnects. On the panel, he discussed the outlook and open challenges for CPO and linear-drive pluggable optics (LPO) with researchers from industry and academia.
SiN-on-Glass (SiNG) as Advanced Packaging Substrates for Next-Generation CPO
After the invited talks, Prof. Kim joined the CPO/LPO panel with the other Session 2 speakers, from NTT, Corning, and the Chinese Academy of Sciences. The panel covered where co-packaged and linear-drive optics are heading for AI-scale interconnects, and the role of advanced packaging substrates such as glass.