Goal

Our research team aims to develope photonic and electronic semiconductor devices and packagings overcoming the conventional AI semiconductor technology limitations by exploring novel materials and device structures, and pacakging architectures. We are highly motivated to solve fundamental technology problems by providing such advanced semiconductor devices and packagings in communication, computing, and sensing.

Our vision

More Details : [한국어], [English]

Enviroment

Our research team has established a state-of-the-art fabrication and measurement infrastructure for advanced co-packaged optics (CPO), silicon photonics, and electronic devices. This integrated environment enables researchers to efficiently prototype, validate, and demonstrate high-impact research outcomes.

Measurement

Fabrication

Specific fields of current interest

• Co-pacakged Optics (Photonics-based advanced packaging systems)
• Silicon Photonics
• Electronics (Advanced DRAM, Memory in display pixels)

Collaborators and Sponsors

• 두뇌한국(BK, Brain Korea)21
• 산업통상자원부
• 한국연구재단
• ETRI 한국전자통신연구원
• KIST 한국과학기술연구원
• IMEC (벨기에, 반도체연구소)
• 삼성전자