Highlight
- We proposed a SiN-on-Glass (SING) platform as a scalable solution for high-density optical redistribution layers (RDL) in next-generation CPO.
- We achieved a peak coupling efficiency of -5.1 dB on glass substrates by integrating a bottom metal reflector to minimize substrate leakage.
- We demonstrated high-density routing with a $100$ $\mu$m bend radius, significantly outperforming conventional glass-based waveguide technologies.
- We realized the platform’s reliability for wafer-scale expansion through stitching error analysis and $106$ Gbps PAM-4 high-speed signal transmission.
Full Article Pages
