At ISMP-IRSP 2024, Prof. Younghyun Kim delivered an invited talk titled ‘Next-Gen Innovations: Co-Packaged Optics and Silicon Photonics.’ The presentation provided a comprehensive review of cutting-edge developments and future directions in this rapidly evolving field.
Prof. Kim’s talk addressed the need for Optical I/O in AI-driven data processing, focusing on Co-Packaged Optics (CPO) and silicon photonics as solutions to interconnect bottlenecks.By integrating photonic chiplets, CPO enables high-speed, energy-efficient data transmission vital for next-gen AI systems, with insights into recent advancements and future directions.